For more than three decades, Remtec has been a premier designer and manufacturer of thick film, direct bond copper substrates and packaging products for the electronics industry. We now lead the industry in specialty metallized applications with our advanced ceramic packaging technology: Plated Copper Thick Film (PCTF®).

• Advanced metallized ceramic circuits, substrates, components & packaging

• AI₂O₃, AIN, BeO, Si₃N₄, & other materials using Active Metal Braze, Direct Bond Copper, Thick Film

• Ideal for thermal challenges of HPSP, optoelectronics, semiconductor manufacturing systems, others

• Design-built, build-to-print, USA-based